Flame Retardant | PX-200

■ Features

Halogen & TPP Free

High HDT & High Hydrolysis Resistance than BDP

Izod Impact Strength can be kept higher than BDP

Suitable for hotmelt adhesives with a melting point of about 92°C

Low dielectric properties provide less damage for Relative Permittivity (εr) and Loss Tangent (tanδ) than conventional reactive flame retardants

Powder/Granular appearance

Soluble in solvents such as MEK

■ Applications

Used as a flame retardant for various engineering plastics and synthetic fibers such as PC/ABS compounds, etc. Its high HDT contributes to thinner and lighter plastic parts.

Effective with oxygen-containing resins such as modified-PPE, phenol, epoxy, and polyurethane

For electronic material applications, used in phenolic, epoxy or modified-PPE laminate applications such as PCB.

Used to add flame retardant and low-dielectric property functions to high-frequency components such as 5G and millimeter wave.

Provides flame retardancy and plasticity to hot melt adhesives.